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| DFM200PXM33-A000 DFM200PXM33-A000 Fast Recovery Diode Module Preliminary Information DS5496-1.3 September 2001 FEATURES s Low Reverse Recovery Charge s High Switching Speed s Low Forward Voltage Drop s Isolated Base s MMC Baseplate With AlN Substrates KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM 3300V 2.5V 200A 400A APPLICATIONS s Chopper Diodes s Boost and Buck Converters s Free-wheel Circuits s Snubber Circuits s Resonant Converters s Induction Heating s Multi-level Switch Inverters The DFM200PXM33-A000 module houses a series connected pair of 3300 volt, fast recovery diodes (FRDs). Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 2(K2) 1(A2/K1) 3(A1) Fig. 1 Circuit diagram ORDERING INFORMATION Order As: DFM200PXM33-A000 Note: When ordering, please use the complete part number. Outline type code: P (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com DFM200PXM33-A000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25C unless stated otherwise Symbol VRRM IF IFM I2t Pmax Visol Qpd Parameter Repetitive peak reverse voltage Forward current (per arm) Max. forward current I2t value fuse current rating Maximum power dissipation Isolation voltage Partial discharge Tvj = 125C DC, Tcase = 70C Tcase = 115C, tp = 1ms VR = 0, tp = 10ms, Tvj = 125C Tcase = 25C, Tvj = 125C Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V1 = 2450V, V2 = 1800V, 50Hz RMS Test Conditions Max. 3300 200 400 20 925 6.0 10 Units V A A kA2s W kV pC THERMAL AND MECHANICAL RATINGS Internal insulation: Baseplate material: Creepage distance: Clearance: CTI (Critical Tracking Index): AlN AlSiC 20mm 10mm 175 Test Conditions Continuous dissipation junction to case Rth(c-h) Thermal resistance - case to heatsink (per module) Tj Tstg Junction temperature Storage temperature range Screw torque Mounting - M6 Electrical connections - M5 Mounting torque 5Nm (with mounting grease) -40 125 125 5 4 C C Nm Nm 16 C/kW Min. Typ. - Symbol Rth(j-c) Parameter Thermal resistance - diode (per arm) Max. 108 Units C/kW 2/7 www.dynexsemi.com DFM200PXM33-A000 STATIC ELECTRICAL CHARACTERISTICS Tvj = 25C unless stated otherwise. Symbol IRM VF Parameter Peak reverse current Forward voltage Test Conditions VR = 3300V, Tvj = 125C IF = 200A IF = 200A, Tvj = 125C L Inductance Min. Typ. 2.5 2.5 30 Max. 15 Units mA V V nH DYNAMIC ELECTRICAL CHARACTERISTICS Tvj = 25C unless stated otherwise. Symbol Irr Qrr Erec Parameter Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 200A, dIF/dt = 1100A/s, VR = 1800V Min. Typ. 165 115 130 Max. Units A C mJ Tvj = 125C unless stated otherwise. Symbol Irr Qrr Erec Parameter Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 200A, dIF/dt = 1000A/s, VR = 1800V Min. Typ. 185 190 220 Max. Units A C mJ 3/7 www.dynexsemi.com DFM200PXM33-A000 TYPICAL CHARACTERISTICS 400 Tj = 25C Tj = 125C 350 Transient thermal impedance, Zth (j-c) - (C/kW ) 1000 300 Forward current, IF - (A) 100 Diode 250 200 150 10 100 50 Ri (C/KW) i (ms) 0.01 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward voltage, VF - (V) 1 0.001 1 2 3 4 2.9545 15.6459 22.2515 67.3233 0.0843 3.7205 33.2138 236.5275 1 10 0.1 Pulse width, tp - (s) Fig. 2 Diode typical forward characteristics 1000 900 300 800 Power dissipation, Ptot - (W) Fig. 4 Transient thermal impedance 350 600 500 400 300 200 DC forward current, IF - (A) 700 250 200 150 100 50 100 0 0 0 25 50 75 100 Case temperature, Tcase - (C) 125 150 0 25 50 75 100 Case temperature, Tcase - (C) 125 150 Fig. 5 Power dissipation Fig. 6DC current rating vs case temperature 4/7 www.dynexsemi.com DFM200PXM33-A000 350 Tj = 125C 300 Reverse recovery current, Irr - (A) 250 200 150 100 50 0 0 500 1000 1500 2000 2500 Reverse voltage, VR - (V) 3000 3500 Fig. 7 RBSOA 5/7 www.dynexsemi.com DFM200PXM33-A000 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Nominal weight: 550g Module outline type code: P 6/7 www.dynexsemi.com DFM200PXM33-A000 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS5496-1 Issue No. 1.3 September 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7 www.dynexsemi.com |
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